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Micron Technology
Micron Technology

MT29C4G96MAZAPCJG-5IT Datasheet Preview

MT29C4G96MAZAPCJG-5IT Datasheet

NAND Flash and Mobile LPDDR

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MT29C4G96MAZAPCJG-5IT pdf
Micron Confidential and Proprietary
Preliminary
168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP
Features
NAND Flash and Mobile LPDDR
168-Ball Package-on-Package (PoP) MCP
Combination Memory (TI OMAP)
MT29C4G48MAYAPAKQ-5 IT, MT29C4G48MAZAPAKQ-5 IT,
MT29C4G48MAZAPAKQ-6 IT, MT29C4G96MAZAPCJG-5 IT,
MT29C4G96MAZAPCJG-6 IT, MT29C8G96MAZAPDJV-5 IT,
MT29C8G96MAZAPDJV-6 IT
Features
Micron® NAND Flash and LPDDR components
RoHS-compliant, “green” package
Separate NAND Flash and LPDDR interfaces
Space-saving multichip package/package-on-package
combination
Low-voltage operation (1.70–1.95V)
Industrial temperature range: –40°C to +85°C
NAND Flash-Specific Features
Organization
Page size
x8: 2112 bytes (2048 + 64 bytes)
x16: 1056 words (1024 + 32 words)
Block size: 64 pages (128K + 4K bytes)
Mobile LPDDR-Specific Features
No external voltage reference required
No minimum clock rate requirement
1.8V LVCMOS-compatible inputs
Programmable burst lengths
Partial-array self refresh (PASR)
Deep power-down (DPD) mode
Selectable output drive strength
STATUS REGISTER READ (SRR) supported1
Notes: 1. Contact factory for remapped SRR output.
2. For physical part markings, see Part Number-
ing Information (page 2).
Figure 1: PoP Block Diagram
NAND Flash
Power
NAND Flash
Device
LPDRAM Power
LPDRAM
Device
NAND Flash
Interface
LPDRAM
Interface
PDF: 09005aef83ba4387
168ball_nand_lpddr_j42p_j4z2_j4z3_omap.pdf – Rev. F 03/10
1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.



Micron Technology
Micron Technology

MT29C4G96MAZAPCJG-5IT Datasheet Preview

MT29C4G96MAZAPCJG-5IT Datasheet

NAND Flash and Mobile LPDDR

No Preview Available !

MT29C4G96MAZAPCJG-5IT pdf
Micron Confidential and Proprietary
Preliminary
168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP
Features
Part Numbering Information
Micron NAND Flash and LPDRAM devices are available in different configurations and densities. The MCP/PoP
part numbering guide is available at www.micron.com/numbering.
Figure 2: Part Number Chart
MT 29C XX XXX X X X X X X X XX
Micron Technology
Product Family
NAND Flash Density
LPDRAM Density
Operating Voltage Range
NAND Flash Configuration
Production Status
Operating Temperature Range
LPDRAM Access Time
Package Codes
Chip Count
LPDRAM Configuration
Device Marking
Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead,
an abbreviated device mark consisting of a 5-digit alphanumeric code is used. The abbreviated device marks are
cross-referenced to the Micron part numbers at the FBGA Part Marking Decoder site: www.micron.com/decoder.
To view the location of the abbreviated mark on the device, refer to customer service note CSN-11, “Product Mark/
Label,” at www.micron.com/csn.
PDF: 09005aef83ba4387
168ball_nand_lpddr_j42p_j4z2_j4z3_omap.pdf – Rev. F 03/10
2 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.


Part Number MT29C4G96MAZAPCJG-5IT
Description NAND Flash and Mobile LPDDR
Maker Micron Technology
Total Page 30 Pages
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