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National Semiconductor Electronic Components Datasheet

M38510-05252BCA Datasheet

Logic Gate

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M38510-05252BCA pdf
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INCH-POUND
MIL-M-38510/52E
3 December 2004
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, CMOS, NOR GATES,
MONOLITHIC SILICON, POSITIVE LOGIC
SUPERSEDING
MIL-M-38510/52D
30 April 1984
Reactivated after 3 December 2004 and may be used for new and existing designs and acquisitions.
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits.
Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance (RHA)
are provided and are reflected in the complete Part or Identifying Number (PIN). For this product, the requirements of
MIL-M-38510 have been superseded by MIL-PRF-38535 (see 6.3).
1.2 Part or identifying number (PIN). The PIN is in accordance with MIL-PRF-38535 and as specified herein.
1.2.1 Device types. The device types are as follows:
Device type
01
02
03
04
51
52
53
54
Circuit
Dual 3-input NOR gate (plus inverter)
Quad 2-input NOR gate
Dual 4-input NOR gate
Triple 3-input NOR gate
Dual 3-input NOR gate (plus inverter)
Quad 2-input NOR gate
Dual 4-input NOR gate
Triple 3-input NOR gate
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
A GDFP5-F14 or CDFP6-F14 14 Flat pack
C GDIP1-T14 or CDIP2-T14
14 Dual-in-line
D GDFP1-F14 or CDFP2-F14 14 Flat pack
T CDFP3-F14
14 Flat pack
X GDFP5-F14 or CDFP6-F14 14 Flat pack, except A dimension
equals 0.1” (2.54 mm) max
Y GDFP1-F14 or CDFP2-F14 14 Flat pack, except A dimension
1/ As an exception to nickel plate or undercoating paragraph of MIL-PRF-38535, appendix A, for case outlines X and Y only,
the leads of bottom brazed ceramic packages (i.e., configuration 2 of case outlines A or D) may have electroless nickel
undercoating which is 50 to 200 microinches (1.27 to 5.08 µm) thick provided the lead finish is hot solder dip (i.e., finish letter
A) and provided that, after any lead forming, an additional hot solder dip coating is applied which extends from the outer tip
of the lead to no more than 0.015 inch (0.38 mm) from the package edge.
2/ For bottom or side brazed packages, case outlines X and Y only, the S1 dimension may go to .000 inch (.00 mm) minimum.
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or email
CMOS@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at http://assist.daps.dla.mil.
wwAwM.SDCaNt/aASheet4U.com
FSC 5962


National Semiconductor Electronic Components Datasheet

M38510-05252BCA Datasheet

Logic Gate

No Preview Available !

M38510-05252BCA pdf
www.DataSheet4U.com
MIL-M-38510/52E
1.3 Absolute maximum ratings.
Supply voltage range (VDD - VSS):
Device types 01, 02, 03, and 04 ...................................................... -0.5 V dc to +15.5 V dc
Device types 51, 52, 53, and 54 ...................................................... -0.5 V dc to +18.0 V dc
Input current (each input) .................................................................. ±10 mA
Input voltage range............................................................................ (VSS - 0.5 V) VI (VDD + 0.5 V)
Storage temperature range (TSTG) .................................................... -65° to +175°C
Maximum power dissipation (PD) ...................................................... 200 mW
Lead temperature (soldering, 10 seconds) ....................................... +300°C
Thermal resistance, junction to case (θJC) ......................................... See MIL-STD-1835
Junction temperature (TJ) ................................................................. 175°C
1.4 Recommended operating conditions.
Supply voltage range (VDD - VSS):
Device types 01, 02, 03, and 04 ...................................................... 4.5 V dc to 12.5 V dc
Device types 51, 52, 53, and 54 ...................................................... 4.5 V dc to 15.0 V dc
Input low voltage range (VIL):
Device types 01, 02, 03, and 04 ...................................................... VOL = 10% VDD, VOH = 90% VDD
0.0 V to 0.85 V dc @ VDD = 5.0 V dc
0.0 V to 2.0 V dc @ VDD = 10.0 V dc
0.0 V to 2.1 V dc @ VDD = 12.5 V dc
Device types 51, 52, 53, and 54 ...................................................... VOL = 10% VDD, VOH = 90% VDD
0.0 V to 1.5 V dc @ VDD = 5.0 V dc
0.0 V to 2.0 V dc @ VDD = 10.0 V dc
0.0 V to 4.0 V dc @ VDD = 15.0 V dc
Input high voltage range (VIH):
Device types 01, 02, 03, and 04 ...................................................... VOL = 10% VDD, VOH = 90% VDD
3.95 V to 5.0 V dc @ VDD = 5.0 V dc
8.0 V to 10.0 V dc @ VDD = 10.0 V dc
10 V to 12.5 V dc @ VDD = 12.5 V dc
Device types 51, 52, 53, and 54 ...................................................... VOL = 10% VDD, VOH = 90% VDD
3.5 V to 5.0 V dc @ VDD = 5.0 V dc
8.0 V to 10.0 V dc @ VDD = 10.0 V dc
11.0 V to 15.0 V dc @ VDD = 15.0 V dc
Load capacitance .............................................................................. 50 pF maximum
Ambient operating temperature range (TA) ....................................... -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or
wwwwww.D.aasstiastS.dahpes.edlta4.mUil.ocrofrmom the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2


Part Number M38510-05252BCA
Description Logic Gate
Maker National Semiconductor
Total Page 30 Pages
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