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Vishay Intertechnology Electronic Components Datasheet

FCSP0730TR Datasheet

Chip Scale Package Schottky Barrier Rectifier

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FCSP0730TR pdf
FCSP0730TR
Vishay High Power Products
FlipKY®
Chip Scale Package Schottky Barrier Rectifier, 0.75 A
FEATURES
• Ultra low VF to footprint area
• Very low profile (< 0.6 mm)
• Low thermal resistance
• Supplied tested and on tape and reel
RoHS
COMPLIANT
FlipKY®
APPLICATIONS
• Reverse polarity protection
• Current steering
• Freewheeling
• Flyback
• Oring
PRODUCT SUMMARY
IF(AV)
VR
0.75 A
30 V
DESCRIPTION
Vishay's FlipKY® product family utilizes wafer level
chip scale packaging to deliver Schottky diodes with the
lowest VF to PCB footprint area in industry. The three pad
0.9 mm x 1.2 mm devices can deliver up to 0.75 A and
occupy only 1.08 mm2 of board space. The anode and
cathode connections are made through solder bump pads on
one side of the silicon enabling designers to strategically
place the diodes on the PCB. This design not only minimizes
board space but also reduces thermal resistance and
inductance, which can improve overall circuit efficiency.
www.DataSheet4U.com
Typical applications include hand-held, portable equipment
such as cell phones, MP3 players, bluetooth, GPS, PDAs,
and portable hard disk drives where space savings and
performance are crucial.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
VRRM
IF(AV)
IFSM
VF
TJ
Rectangular waveform
0.75 Apk, TJ = 125 °C
MAX.
30
0.75
190
0.37
- 55 to 150
UNITS
V
A
V
°C
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
VR
VRWM
FCSP0730TR
30
UNITS
V
Document Number: 94336
Revision: 27-Feb-08
For technical questions, contact: diodes-tech@vishay.com
www.vishay.com
1


Vishay Intertechnology Electronic Components Datasheet

FCSP0730TR Datasheet

Chip Scale Package Schottky Barrier Rectifier

No Preview Available !

FCSP0730TR pdf
FCSP0730TR
Vishay High Power Products
FlipKY®
Chip Scale Package Schottky
Barrier Rectifier, 0.75 A
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average forward current
IF(AV)
Maximum peak one cycle
non-repetitive surge current at 25 °C
IFSM
Non-repetitive avalanche energy
Repetitive avalanche current
EAS
IAR
TEST CONDITIONS
50 % duty cycle at TPCB = 127 °C, rectangular waveform
5 µs sine or 3 µs rect. pulse
10 ms sine or 6 ms rect. pulse
Following any rated
load condition and with
rated VRRM applied
TJ = 25 °C, IAS = 2.0 A, L = 5.0 mH
Current decaying linearly to zero in 1 µs
Frequency limited by TJ maximum VA = 1.5 x VR typical
VALUES
0.75
190
10
5
0.5
UNITS
A
mJ
A
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum forward voltage drop
See fig. 1
VFM (1)
Maximum reverse leakage current
See fig. 2
IRM (1)
Maximum junction capacitance
Maximum voltage rate of charge
CT
dV/dt
Note
(1) Pulse width < 300 µs, duty cycle < 2 %
TEST CONDITIONS
0.75 A
1.5 A
TJ = 25 °C
0.75 A
1.5 A
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
VR = Rated VR
VR = 5 VDC (test signal range 100 kHz to 1 MHz) 25 °C
Rated VR
TYP.
0.43
0.50
0.33
0.43
10
5
-
-
MAX.
0.47
0.54
0.37
0.47
50
15
90
10 000
UNITS
V
µA
mA
pF
V/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
www.DaMtaaSxhimeeutm4Uju.cnocmtion and
storage temperature range
Typical thermal resistance,
junction to PCB
TJ (1), TStg
RthJL (2) DC operation
Typical thermal resistance,
junction to ambient
RthJA
TEST CONDITIONS
Notes
(1) d----P-----t-o---t < ------1-------- thermal runaway condition for a diode on its own heatsink
dTJ RthJA
(2) Mounted on minimum footprint PCB
VALUES
- 55 to 150
35
150
UNITS
°C
°C/W
www.vishay.com
2
For technical questions, contact: diodes-tech@vishay.com
Document Number: 94336
Revision: 27-Feb-08


Part Number FCSP0730TR
Description Chip Scale Package Schottky Barrier Rectifier
Maker Vishay Siliconix
Total Page 5 Pages
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