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AK59256AG - 262144 Word by 32 Bit CMOS Dynamic Random Access Memory

This page provides the datasheet information for the AK59256AG, a member of the AK59256AS 262144 Word by 32 Bit CMOS Dynamic Random Access Memory family.

Description

The Accutek AK59256A high density memory modules is a random access memory organized in 256K x 9 bit words.

The assembly consists of two 256K x 4 and one 256K x 1 DRAMs in surface mount packages mounted to the front side of a printed circuit board.

Features

  • 262,144 x 9 bit organization.
  • Optional 30 Pad SIM (Single In-Line Module) or 30 Pin leaded SIP (Single In-Line Package).
  • JEDEC standard pinout.
  • Common CAS, RAS and WE control for the lower eight bits.
  • Separate PCAS control for D9 and Q9.
  • Power: 1.26 Watt Max Active (70 nSEC) 1.10 Watt Max Active (80 nSEC) .935 Wat Max Active (100 nSEC) 22 mWatt Standby (Max).
  • Operating free air temperature: 0o to 70oC.
  • Upward compatible with AK491024, AK591024, AK594096.

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Datasheet preview – AK59256AG

Datasheet Details

Part number AK59256AG
Manufacturer ACCUTEK
File Size 160.21 KB
Description 262144 Word by 32 Bit CMOS Dynamic Random Access Memory
Datasheet download datasheet AK59256AG Datasheet
Additional preview pages of the AK59256AG datasheet.

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Other Datasheets by ACCUTEK
  • AK59256AS - 262144 Word by 32 Bit CMOS Dynamic Random Access Memory
  • AK591024AG - 1048576 Word x 9 Bit CMOS Dynamic Random Access Memory
  • AK591024AS - 1048576 Word x 9 Bit CMOS Dynamic Random Access Memory
  • AK5916384G - 16777216 Word by 9 Bit CMOS Dynamic Random Access Memory
  • AK5916384S - 16777216 Word by 9 Bit CMOS Dynamic Random Access Memory
  • AK594096AG - 4194304 Word x 9 Bit CMOS Dynamic Random Access Memory
  • AK594096AS - 4194304 Word x 9 Bit CMOS Dynamic Random Access Memory
  • AK594096BG - 4194304 Word by 9 Bit CMOS Dynamic Random Access Memory

Full PDF Text Transcription

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MICROCIRCUIT CORPORATION DESCRIPTION The Accutek AK59256A high density memory modules is a random access memory organized in 256K x 9 bit words. The assembly consists of two 256K x 4 and one 256K x 1 DRAMs in surface mount packages mounted to the front side of a printed circuit board. The module can be configured as a leadless 30 pad SIM or a leaded 30 pin SIP. This packaging approach provides a better than 6 to 1 density increase over standard DIP packaging. The operation of the AK59256A is identical to two 256K x 4 DRAMs plus one 256K x 1 DRAM. For the lower eight bits data input is tied to data output and brought out separately for each 256K x 4 device, with common RAS, CAS and WE control.
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