900,000+ datasheet pdf search and download

Datasheet4U offers most rated semiconductors data sheet pdf






AMI SEMICONDUCTOR

AMIS-720442-A Datasheet Preview

AMIS-720442-A Datasheet

Image Sensor

No Preview Available !

AMIS-720442-A: 400dpi Contact Image Sensor
Data Sheet
1.0 Description
AMI Semiconductor’s AMIS-720442-A (PI3042A) contact image sensor (CIS) is a 400 dots per inch (dpi) linear array image sensor
chip. The sensor chip is processed using a CMOS image sensing technology, belonging to AMIS. Designed for cascading multiple
chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB). This
bonding process allows the manufacturers to produce variable CIS module lengths in increments of chip array lengths. This allows a
wide variety of image reading widths which are easily applied to the numerous document scanners found in facsimile, as well as the
narrow width scanners, such as, those found in check reader, lotto tickets, entrance gates tickets, etc. Included in this list of scanners
are various types of automated office equipment which require a wide variety of scanning widths.
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 128 detector elements, their associated
multiplexing switches, buffers and a chip selector. The detector's element-to-element spacing is approximately 62.5µm. The size of
each chip without scribe lines is 8080µm by 385µm. Each sensor chip has seven bonding pads. The pad symbols and functions are
described in Table 1.
Buffer
SP
www.DataSheet4U.com
8080 m
Row of 128 Sensors
and Video Signal
Multiplexers
Readout Shift Register
Buffer
CP VDD DGND
Chip
Select
IOUT
Figure 1: AMIS-720442-A Block Diagram
385 m
Buffer
AGND EOS
Table 1: Pad Symbols and Functions
Symbol
Function
SP Start pulse: input clock to start the line scan
CP Clock pulse: input clock to clock of the shift register
VDD
Positive supply: +5V supply connected to substrate
DGND
Digital ground: connection topside common
IOUT
Signal current output: output for video signal current
AGND
Analog ground: connection topside common
EOS
End-of-scan pulse: output from the shift register at end-of-scan
AMI Semiconductor – May 06, M-20571-001
www.amis.com
1




AMI SEMICONDUCTOR

AMIS-720442-A Datasheet Preview

AMIS-720442-A Datasheet

Image Sensor

No Preview Available !

AMIS-720442-A: 400dpi Contact Image Sensor
Data Sheet
2.0 Bonding Pad Output Locations and Die Dimensions
Figure 2 shows the die dimensions of the image sensor and the bonding pad locations for the AMIS-720442-A sensor chip. The location
is referenced to the lower left corner of the die.
www.DataSheet4U.com
Figure 2: Bonding Pad and Chip Layout
AMI Semiconductor – May 06, M-20571-001
www.amis.com
2


Part Number AMIS-720442-A
Description Image Sensor
Maker AMI SEMICONDUCTOR
PDF Download

AMIS-720442-A Datasheet PDF






Similar Datasheet

1 AMIS-720442-A Image Sensor
AMI SEMICONDUCTOR





Part Number Start With

0    1    2    3    4    5    6    7    8    9    A    B    C    D    E    F    G    H    I    J    K    L    M    N    O    P    Q    R    S    T    U    V    W    X    Y    Z



Site map

Webmaste! click here

Contact us

Buy Components

Privacy Policy