PI3039 Datasheet | AMI SEMICONDUCTOR

Description : Peripheral Imaging Corporation PI3039 CIS (Contact Image Sensor) sensor chip is a linear array image sensor chip with a 600 elements per inch resolution. The sensor chip is fabricated with PIC’s proprietary CMOS Image Sensing Technology. Since this image sensor chip is intended for CIS module applications, multiple numbers of these sensors will be serially cascaded to form a linear scanning image array of arbitrary length. These sensors are butted end-to-end on a printed circuit board (PCB). The sensors are mounted using the chip-onboard technology to form scanning arrays with various lengths 8080 µm 1 2 3 4 189 190 191 192 ROW OF 192 SENSORS AND VIDEO SIGNAL LINE MULTIPLEXER READ OUT SHIFT REGISTER 360 µm BUFFER BUFFER CHIP SELECT BUFFER IOUT Figure 1. PI3039 Sensor Block Diagram Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 192 detector elements, their associated multiplexing switches, buffer amplifiers, and a chip selector. The detector's elementto-element spacing is approximately 42µm. The size of each chip without the scribe lines is 8080 µm by 360 µm. Each sensor chip has 6 bonding pads. The pad symbols and functions are described in Table 1. Page 1 of 10, PI3039, 12/2/02 .. SYMBOL SP CP VDD VSS IOUT EOS FUNCTION Start Pulse: Input to start the line scan. Clock Pulse: Input to clock the Shift Register. Positive Supply: +5 volt supply connected to substrate. VSS is tied to ground: Connection topside mon Video Signal Current Output from a source follower. End of Scan Pulse: Output from the shift register at end of scan. Table 1. Pad Symbols and Functions 8080 µm Read Line PI3039 IMAGE SENSOR, 192 PIXELS, 42 µm PITCH 333 µm 360 µm EOS IOUT NOTE: ALL PAD OPENINGS ARE 140 X 80 µm FUNCTION START INPUT CLOCK INPUT +5 SUPPLY TIED TO GROUND VIDEO SIGNAL OUT SCAN OUTPUT Y 30 30 30 30 30 30 X 575 2195 3295 4373 5495 7272 NOTES: 1. THE DRAWING IS NOT TO SCALE....