PI3041A Datasheet | AMI SEMICONDUCTOR

Description : Peripheral Imaging Corporation PI3041A CIS, Contact Image Sensor, chip is a 300 dot per inch resolution, linear array image sensor chip. The sensor chip is processed using a CMOS Image Sensing Technology, a possession of ISPL (Image Sensor Product Line) group within AMIS. Designed for cascading multiple chips in a series, the image sensor chips, uses a chipon-board process. They are bonded end-to-end on a printed circuit board (PCB). This bonding process allows the CIS module manufacturers to produce variable CIS module lengths in increments of the chip array lengths. Hence, the modules are easily applied in a large number of document scanners, found in today’s facsimile market. Examples are wide format maps and architectural drawings scanners down to the narrow width scanners, such as, those found in check readers, lotto tickets, entrance gates tickets, etc. This is not to exclude the many office automation equipments, which require an even more variety in scanning widths, as well as, those with special mechanically configurations. Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 96 detector elements, their associated multiplexing switches, buffers, and a chip selector. The detector's element-to-element spacing is approximately 83.3 µm. The size of each chip without scribe lines is 8080 µm by 380 µm. Each sensor chip has 7 bonding pads. The pad symbols and functions are described in Table 1. 8080 µm Row of 96 Sensors and Video Signal Multiplexers Readout Shift Register 380 µm Buffer SP Buffer CP VDD DGND Chip Select IOUT Buffer AGND EOS Figure 1. PI3041A Block Diagram SYMBOL SP CP VDD DGND IOUT AGND EOS FUNCTION Start Pulse: Input clock to start the line scan. Clock Pulse: Input clock to clock of the Shift Register. Positive Supply: +5 volt supply connected to substrate. Digital Ground: Connection topside mon Signal Current Output: Output for video signal current Analog Ground: Connection topside mon End of...