PI3042A Datasheet | AMI SEMICONDUCTOR

Description : Peripheral Imaging Corporation PI3042A CIS, Contact Image Sensor is a 400 dot per inch (dpi) resolution, linear array image sensor chip. The sensor chip is processed using PIC’s proprietary CMOS Image Sensor Technology. Designed for cascading multiple chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB). This bonding process allows users to produce variable CIS module lengths in increments of chip array lengths. Hence, the wide variety of image reading widths can easily be applied to the numerous document scanners, found in facsimile, as well as, the narrow width scanners, such as, those found in check readers, lotto tickets, entrance gate tickets and other office automation equipment which requires a wide variety of scanning widths. Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 128 detector elements, their associated multiplexing switches, buffers, and a chip selector. The detectors element-to-element spacing is approximately 62.5 µm. The size of each chip without scribe lines is 8080 µm by 385 µm. Each sensor chip has 7 bonding pads. The pad symbols and functions are described in Table 1. 8080µm 1 2 3 Row of 128 Sensors 125 and Video Signal Multiplexers Readout Shift Register 385µm Buffer SP Buffer CP VDD DGND Chip Select IOUT Buffer AGND EOS Figure 1. PI3042A Block Diagram SYMBOL SP CP VDD DGND IOUT AGND EOS FUNCTION Start Pulse: Input clock to start the line scan. Clock Pulse: Input clock to clock of the Shift Register. Positive Supply: +5 volt supply connected to substrate. Digital Ground: Connection topside mon Signal Current Output: Output for video signal current Analog Ground: Connection topside mon End of Scan Pulse: Output from the shift register at end of scan. Table 1. Pad Symbols and Functions Page 2 of 18 Date: 09/23/05 Preliminary PI3042A datasheet Bonding Pad Outputs Locations and Die...