AWT6274 datasheet, module equivalent, ANADIGICS

Features and benefits

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* InGaP HBT Technology High Efficiency: 43 % @ POUT = +29 dBm 21 % @ POUT = +16 dBm 15 % @ POUT = +7 dBm
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Application

PRODUCT DESCRIPTION The AWT6274 meets the increasing demands for higher output power in UMTS handsets. The PA module is.

Description

The AWT6274 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6275 chipset. The device is manufactured on an advanced InGaP HBT MMI.

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