AWT6276R Description
The AWT6276 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for patibility with the Qualm® 6275 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.
AWT6276R Key Features
- InGaP HBT Technology High Efficiency: 45 % @ POUT = +29.5 dBm 21 % @ POUT = +16 dBm 16 % @ POUT = +7 dBm
- Low Quiescent Current: 15 mA Low Leakage Current in Shutdown Mode: <1 µA VREF = +2.85 V (+2.75 V min over temp) Optimize