AWT6274 Description
The AWT6274 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for patibility with the Qualm® 6275 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.
AWT6274 Key Features
- InGaP HBT Technology High Efficiency: 43 % @ POUT = +29 dBm 21 % @ POUT = +16 dBm 15 % @ POUT = +7 dBm