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AWT6274 - Linear Power Amplifier Module

Datasheet Summary

Description

The AWT6274 meets the increasing demands for higher output power in UMTS handsets.

The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6275 chipset.

Features

  • InGaP HBT Technology High Efficiency: 43 % @ POUT = +29 dBm 21 % @ POUT = +16 dBm 15 % @ POUT = +7 dBm.
  • Low Quiescent Current: 15 mA Low Leakage Current in Shutdown Mode:.

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Datasheet preview – AWT6274

Datasheet Details

Part number AWT6274
Manufacturer ANADIGICS
File Size 313.07 KB
Description Linear Power Amplifier Module
Datasheet download datasheet AWT6274 Datasheet
Additional preview pages of the AWT6274 datasheet.

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Full PDF Text Transcription

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www.DataSheet4U.com TM AWT6274 HELP PCS/WCDMA 3.4V/29dBm Linear Power Amplifier Module PRELIMINARY DATA SHEET - Rev 1.8 FEATURES • • InGaP HBT Technology High Efficiency: 43 % @ POUT = +29 dBm 21 % @ POUT = +16 dBm 15 % @ POUT = +7 dBm • • • • • • • • • Low Quiescent Current: 15 mA Low Leakage Current in Shutdown Mode: <1 µA VREF = +2.85 V (+2.75 V min over temp) Optimized for a 50 Ω System Low Profile Miniature Surface Mount Package: 1.1 mm Max RoHS Compliant Package, 250 oC MSL-3 HSDPA Capable Dual Band WCDMA Wireless Handsets Dual Mode 3GPP Wireless Handsets AWT6274 M20 Package 10 Pin 4 mm x 4 mm x 1.1 mm Surface Mount Module APPLICATIONS PRODUCT DESCRIPTION The AWT6274 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.
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