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AWT6274 - Linear Power Amplifier Module

General Description

The AWT6274 meets the increasing demands for higher output power in UMTS handsets.

The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6275 chipset.

Key Features

  • InGaP HBT Technology High Efficiency: 43 % @ POUT = +29 dBm 21 % @ POUT = +16 dBm 15 % @ POUT = +7 dBm.
  • Low Quiescent Current: 15 mA Low Leakage Current in Shutdown Mode:.

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Datasheet Details

Part number AWT6274
Manufacturer ANADIGICS
File Size 313.07 KB
Description Linear Power Amplifier Module
Datasheet download datasheet AWT6274 Datasheet

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Other Datasheets by ANADIGICS

Part Number Description
AWT6270 Linear Power Amplifier Module
AWT6271 Linear Power Amplifier Module
AWT6272R Linear Power Amplifier Module
AWT6273 HELP3 Cellular/WCDMA 3.4 V/29 dBm Linear Power Amplifier Module
AWT6275 Linear Power Amplifier Module

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com TM AWT6274 HELP PCS/WCDMA 3.4V/29dBm Linear Power Amplifier Module PRELIMINARY DATA SHEET - Rev 1.8 FEATURES • • InGaP HBT Technology High Efficiency: 43 % @ POUT = +29 dBm 21 % @ POUT = +16 dBm 15 % @ POUT = +7 dBm • • • • • • • • • Low Quiescent Current: 15 mA Low Leakage Current in Shutdown Mode: <1 µA VREF = +2.85 V (+2.75 V min over temp) Optimized for a 50 Ω System Low Profile Miniature Surface Mount Package: 1.1 mm Max RoHS Compliant Package, 250 oC MSL-3 HSDPA Capable Dual Band WCDMA Wireless Handsets Dual Mode 3GPP Wireless Handsets AWT6274 M20 Package 10 Pin 4 mm x 4 mm x 1.1 mm Surface Mount Module APPLICATIONS PRODUCT DESCRIPTION The AWT6274 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.