ANADIGICS AWT6274
Linear Power Amplifier Module
| Part No. | AWT6274 |
|---|---|
| Datasheet | AWT6274 Download |
| Manufacturer |  ANADIGICS |
| Description | Linear Power Amplifier Module |
| Buy | Stock & Price |
FEATURES
●● InGaP HBT Technology High Efficiency: 43 % @ POUT = +29 dBm 21 % @ POUT = +16 dBm 15 % @ POUT = +7 dBm
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● Low Quiescent Current: 15 mA Low Leakage Current in Shutdown Mode: <1 µA VREF = +2.85 V (+2.75 V min over temp) Optimized for a 50 Ω System Low Profile Miniature Surface Mount Package: 1.1 mm Max RoHS Compliant Package, 250 oC MSL-3 HSDPA Capable Dual Band WCDMA Wireless Handsets Dual Mode 3GPP Wireless Handsets AWT6274 M20 Package 10 Pin 4 mm x 4 mm x 1.1 mm Surface Mount Module
APPLICATIONS
PRODUCTDESCRIPTION
The AWT6274 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6275 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, increase handset talk and standby time.
