AWT6275
Overview
- InGaP HBT Technology High Efficiency: 43% @ POUT = +27.5 dBm 21% @ POUT = +16 dBm 15% @ POUT = +7 dBm * * * * * * * *
- Low Quiescent Current: 16 mA Low Leakage Current in Shutdown Mode: <1 µA VREF = +2.85 V (+2.75 V min over temp) Optimized for a 50 Ω System Low Profile Miniature Surface Mount Package Option: 1.1 mm Max RoHS Compliant Package, 250 oC MSL-3 HSDPA Capable Dual Band WCDMA Wireless Handsets Dual Mode 3GPP Wireless Handsets bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, increase handset talk and standby time. The self-contained 4 mm x 4 mm x 1.5 mm surface mount package incorporates matching networks optimized for output power, efficiency, and linearity in a 50 Ω system. AWT6275 M20 Package 10 Pin 4 mm x 4 mm x 1.1 mm Surface Mount Module
