ANADIGICS AWT6270
Linear Power Amplifier Module
| Part No. | AWT6270 |
|---|---|
| Datasheet | AWT6270 Download |
| Manufacturer |  ANADIGICS |
| Description | Linear Power Amplifier Module |
| Buy | Stock & Price |
FEATURES
●● InGaP HBT Technology High Efficiency: 44% @ POUT = +27 dBm 21% @ POUT = +16 dBm 15% @ POUT = +7 dBm
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● Low Quiescent Current: 16 mA Low Leakage Current in Shutdown Mode: <1 µA VREF = +2.85 V (+2.75 V min over temp) Optimized for a 50 Ω System Low Profile Miniature Surface Mount Package: 1.61 mm Max AWT6270
APPLICATIONS
● Dual Band WCDMA Wireless Handsets M7 Package 10 Pin 4 mm x 4 mm x 1.6 mm Surface Mount Module PRODUCTDESCRIPTION
The AWT6270 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, increase handset talk and standby time. The self-contained 4 mm x 4 mm x 1.6 mm surface mount package incorporates matching networks optimized for output power, efficiency, and linearity in a 50 Ω system.
