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AWT6271 - Linear Power Amplifier Module

General Description

The AWT6271 meets the increasing demands for higher output power in UMTS handsets.

The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset.

Key Features

  • InGaP HBT Technology High Efficiency: 45 % @ POUT = +28 dBm 20 % @ POUT = +16 dBm 15 % @ POUT = +7 dBm.
  • Low Quiescent Current: 16 mA Low Leakage Current in Shutdown Mode:.

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Datasheet Details

Part number AWT6271
Manufacturer ANADIGICS
File Size 254.27 KB
Description Linear Power Amplifier Module
Datasheet download datasheet AWT6271 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com AWT6271 HELP Cellular/WCDMA 3.4V/28dBm Linear Power Amplifier Module PRELIMINARY DATA SHEET - Rev 1.8 TM FEATURES • • InGaP HBT Technology High Efficiency: 45 % @ POUT = +28 dBm 20 % @ POUT = +16 dBm 15 % @ POUT = +7 dBm • • • • • • • Low Quiescent Current: 16 mA Low Leakage Current in Shutdown Mode: <1 µA VREF = +2.85 V (+2.75 V min over temp) Optimized for a 50 Ω System Low Profile Miniature Surface Mount Package: 1.1 mm Max RoHS Compliant Package, 250 oC MSL-3 HSDPA Capable AWT6271 M20 Package 10 Pin 4 mm x 4 mm x 1.1 mm Surface Mount Module APPLICATIONS • • Dual Band WCDMA Wireless Handsets Dual Mode 3GPP Wireless Handsets MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.