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HCPL-2411 Datasheet Preview

HCPL-2411 Datasheet

20 MBd High CMR Logic Gate Optocouplers

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HCPL-2400 / 2411, HCPL-2430
20 MBd High CMR Logic Gate Optocouplers
Reliability Data Sheet
Description
The reliability data shown includes Avago Technologies
reliability test data from the past two years on this
product family. All of these products use the same
LEDs, similar IC, and the same packaging materials,
processes, stress conditions and testing. The data in
Table 1 and Table 2 reflect actual test data for devices
on a per channel basis. Before stress, all devices are
preconditioned using a solder reflow process (260°C,
5 sec. 2X) and 20 temperature cycles (-55°C to +125°C,
15 minutes dwell, 5 minutes transfer). These data are
taken from testing on Avago Technologies devices
using internal Avago Technologies process, material
specifications, design standards, and statistical process
controls. THEY ARE NOT TRANSFERABLE TO OTHER
MANUFACTURERS’ SIMILAR PART TYPES.
Operating Life Test
For valid system reliability calculations it is necessary to
adjust for the time when the system is not in operation.
Note that if you are using MIL-HDBK-217 for predicting
component reliability, the results may not be compara-
ble to those given in Table 2 due to different conditions
and factors that have been accounted for in MIL-HDBK-
217. For example, it is unlikely that your application will
exercise all available channels at full rated power with
the LED(s) always ON as Avago Technologies testing
does. Thus, your application total power and duty cycle
must be carefully considered when comparing Table 2
to predictions using MIL-HDBK-217.
Table 1. Demonstrated Operating Life Test Performance
Stress Test
Condition
Total Devices Total Device
Tested
Hours
TA = +85°C
VCC = 5.5 V
Iin = 10 mA
Iout = 25 mA
400
720,000
Number of
Failed Units
0
Demonstrated
MTTF (hr) @
TA = +85°C
> 720,000
Demonstrated
FITs @
TA = +85°C
< 1,389
Definition of Failure
Inability to switch, i.e., “functional failure”, is the defini-
tion of failure in this data sheet. Specifically, failure oc-
curs when the device fails to switch ON with 2 times the
minimum recommended drive current (but not exceed-
ing the max. rating) or fails to switch OFF when there is
no input current.
Application Information
The data of Tables 1 and 2 were obtained on devices
with high temperature operating life duration up to
1000 hours. An exponential (random) failure distribu-
tion is assumed, expressed in units of FIT (failures per
billion device hours) are only defined in the random
failure portion of the reliability curve.
Failure Rate Projections
The demonstrated point mean time to failure (MTTF) is
measured at the absolute maximum stress condition.
The failure rate projections in Table 2 use the Arrhenius
acceleration relationship, where a 0.43eV activation en-
ergy is used as in the hybrid section of MIL-HDBK-217.




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HCPL-2411 Datasheet Preview

HCPL-2411 Datasheet

20 MBd High CMR Logic Gate Optocouplers

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Table 2. Reliability Projections (per channel) for Devices Listed in Title
Ambient
Temperature (°C)
85
70
60
50
40
30
25
Junction
Temperature (°C)
100
85
75
65
55
45
40
Typical (60% Confidence)
MTTF
(hr/fail)
FITs
(fail/109hr)
785,777
1,375,229
2,051,479
3,133,550
4,911,610
7,919,305
10,171,613
1,273
727
487
319
204
126
98
90% Confidence
MTTF
(hr/fail)
FITs
(fail/109hr))
312,692
547,258
816,364
1,246,962
1,954,522
3,151,402
4,047,683
3,198
1,827
1,225
802
512
317
247
Table 3. Mechanical Tests (Testing done on a constructional basis)
Test Name
MIL-STD-883
Temperature Cycle 1010 Cond. B
Mechanical Shock 2002 Cond. B
Mechanical
2007 Cond. A
Vibration
Terminal Strength 2004
Solderability
2003
Physical Dimension 2009
Test Conditions
-55 to 125°C
Transfer = 5 mins
Dwell = 15 mins
1000 cycles
2 blows each axis,
1500 G, 0.5 ms pulse
20 G, 20 - 2000 Hz
4 mins/cycle, 4 times/axis
2 lb tension
8 oz lead bend stress
Sn60 Pb40 Solder
Temp. = 260°C (5 sec, 2X)
Dev. profile @ 10X
Units Tested Units Failed
160 0
139 0
139 0
150 0
397 0
220 0
Table 4. Basic Material Properties
Material Property
Mold Compound Flammability Classification
Mold Compound Oxygen Index
Mold Compound Glass Transition Temperature
Mold Compound Hydrolizable Chlorine
Test Result
UL 94V-0
32%
Tg = 160°C
< 30 ppm
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5988-4129EN
AV01-0497EN - October 9, 2006


Part Number HCPL-2411
Description 20 MBd High CMR Logic Gate Optocouplers
Maker Avago
Total Page 2 Pages
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