HSMF-C116 chipled equivalent, ultra small surface mount tricolor chipled.
* LED with AlInGaP and InGaN die
* Surface mount device with ultra small 1.0 × 1.0mm
footprint
* Suitable for application that requires small pitch size
*.
The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die. To improve contrast the PC.
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