HSMF-C166 (Avago)
Miniature Bi-Color Surface Mount ChipLEDs
HSMF-C16x
Miniature Bi-Color Surface Mount ChipLEDs
Data Sheet
Description
This series of bi-color ChipLEDs is designed with the smallest footprin
(2 views)
HSMF-C167 (Avago)
Miniature Bi-Color Surface Mount ChipLEDs
HSMF-C16x
Miniature Bi-Color Surface Mount ChipLEDs
Data Sheet
Description
This series of bi-color ChipLEDs is designed with the smallest footprin
(2 views)
HSMF-C15A (AVAGO)
Bi Color Surface Mount ChipLED
HSMF-C150/C15A Bi Color Surface Mount ChipLED Data Sheet
Caution: This LED is Class 1A ESD sensitive. Please observe appropriate precautions during ha
(2 views)
LGQ971 (Siemens Semiconductor Group)
CHIPLED
CHIPLED
LG Q971
Besondere Merkmale
q q q q q q
Gehäusebauform: 0603 Industriestandard bzgl. Lötpadraster geringe Bauteilhöhe für IR-Lötung geeignet
(1 views)
LGR971 (Siemens Semiconductor Group)
CHIPLED
CHIPLED
LG R971
Besondere Merkmale
q q q q q q
Gehäusebauform: 0805 Industriestandard bzgl. Lötpadraster geringe Bauteilhöhe für IR-Lötung geeignet
(1 views)
LGR971-KO (Siemens Semiconductor Group)
CHIPLED
CHIPLED
LG R971
Besondere Merkmale
q q q q q q
Gehäusebauform: 0805 Industriestandard bzgl. Lötpadraster geringe Bauteilhöhe für IR-Lötung geeignet
(1 views)
CHIPLED
LY R970, LO R970, LS R970
Besondere Merkmale
q Gehäusebauform: 0805 q Industriestandard bzgl. Lötpadraster q geringe Bauteilhöhe q für IR-Lö
(1 views)
CHIPLED
LY R970, LO R970, LS R970
Besondere Merkmale
q Gehäusebauform: 0805 q Industriestandard bzgl. Lötpadraster q geringe Bauteilhöhe q für IR-Lö
(1 views)
CHIPLED
LY R976, LO R976, LS R976
Besondere Merkmale
q Gehäusebauform: 0805 q Industriestandard bzgl. Lötpadraster q geringe Bauteilhöhe q für IR-Lö
(1 views)
CHIPLED
LY R976, LO R976, LS R976
Besondere Merkmale
q Gehäusebauform: 0805 q Industriestandard bzgl. Lötpadraster q geringe Bauteilhöhe q für IR-Lö
(1 views)
LYR970 (Siemens Semiconductor Group)
CHIPLED
CHIPLED
LY R970, LO R970, LS R970
Besondere Merkmale
q q q q q q
Gehäusebauform: 0805 Industriestandard bzgl. Lötpadraster geringe Bauteilhöhe für
(1 views)
LYR976 (Siemens Semiconductor Group)
CHIPLED
CHIPLED
LY R976, LO R976, LS R976
Besondere Merkmale
q q q q q q
Gehäusebauform: 0805 Industriestandard bzgl. Lötpadraster geringe Bauteilhöhe für
(1 views)
VLMW1301 (Vishay)
Highbright 0603 ChipLED
www.vishay.com
VLMW1301
Vishay Semiconductors
Highbright 0603 ChipLED
DESCRIPTION
The new 0603 ChipLED series have been designed in the smallest SM
(1 views)
VLMW1301-GS08 (Vishay)
Highbright 0603 ChipLED
www.vishay.com
VLMW1301
Vishay Semiconductors
Highbright 0603 ChipLED
DESCRIPTION
The new 0603 ChipLED series have been designed in the smallest SM
(1 views)
VLMW1501-GS08 (Vishay)
Ultrabright 0402 ChipLED
www.vishay.com
VLMW15..
Vishay Semiconductors
Ultrabright 0402 ChipLED
DESCRIPTION The new 0402 ChipLED series has been designed in the smallest SM
(1 views)
VLMW1502-GS08 (Vishay)
Ultrabright 0402 ChipLED
www.vishay.com
VLMW15..
Vishay Semiconductors
Ultrabright 0402 ChipLED
DESCRIPTION The new 0402 ChipLED series has been designed in the smallest SM
(1 views)
EOC-20 (Elcos AG)
High Power Chipled
AG
Luitpoldstr. 6 D-85276 Pfaffenhofen
High Power Chipled - EOC - 20 Series
Preliminary Data
Features
Directive characteristic Size
Soldering patte
(1 views)
LOQ976 (OSRAM GmbH)
Hyper CHIPLED
www.DataSheet4U.com
Hyper CHIPLED Hyper-Bright LED LS Q976, LO Q976, LY Q976
Besondere Merkmale • Gehäusetyp: 0603 • Besonderheit des Bauteils: klei
(1 views)
LSQ976 (OSRAM GmbH)
Hyper CHIPLED
www.DataSheet4U.com
Hyper CHIPLED Hyper-Bright LED LS Q976, LO Q976, LY Q976
Besondere Merkmale • Gehäusetyp: 0603 • Besonderheit des Bauteils: klei
(1 views)
LYQ976 (OSRAM GmbH)
Hyper CHIPLED
www.DataSheet4U.com
Hyper CHIPLED Hyper-Bright LED LS Q976, LO Q976, LY Q976
Besondere Merkmale • Gehäusetyp: 0603 • Besonderheit des Bauteils: klei
(1 views)
