SS10PU200S Key Features
- Very low profile
- typical height of 1.1 mm
- Ideal for automated placement
- Low forward voltage drop, low power losses
- High efficiency
- Low thermal resistance
- Meets MSL level 1, per J-STD-020
- Solder dip 260 °C max. 10 s, per JESD 22-A111
- RoHS pliant package Mechanical Data
- Case: Conform to JEDEC TO-277A; Suffix /A
