Description
P-N Junction Area (μm) Chip Top Area (μm) Chip Thickness (μm) Chip Bottom Area (μm) Au Bond Pad Diameter (μm) Bonding Area Diameter (μm) Note 5 Au Bond Pad Thickness (μm) Backside Contact Metal Area (μm)
CxxxUT170-Sxxxx-31
Dimension
Tolerance
140 x 140
± 25
170 x 170
± 25
50
± 10
130 x 130
± 25
85
-5, +15
70
-5, +15
1.2
± 0.5
80 x 80
± 25
Notes:
1. Maximum ratings are package dependent.The above ratings were determined using a thru-hole package (with Hysol® OS4000 encapsulan
Features
- Small Chip.
- 170 x 170 x 50 μm.
- Single Wire Bond Structure.
- UT LED Performance.
- 450 nm.
- 12+ mW.
- 460 nm.
- 10+ mW.
- 470 nm.
- 10+ mW.
- 527 nm.
- 4+ mW.
- Low Forward Voltage.
- 2.9 V Typical at 5 mA.
- 2kV Class 2 ESD Rating.
C450UT170-CREE.pdf
