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California Micro Devices

CM1205 Datasheet Preview

CM1205 Datasheet

ESD Protection Arrays Chip

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CM1205www.DataSheet4U.com
ESD Protection Arrays, Chip Scale Package
Features
• Functionally and pin compatible with CAMD’s
PACDN1404C, PACDN1408C and PACDN1416C
family of ESD protection devices
• 4, 8, or 16 transient voltage suppressors in a single
package
• OptiguardTM coated for improved reliability at
assembly
• In-system Electrostatic Discharge (ESD) protection
to +25kV contact discharge per IEC 61000-4-2
international standard
• Compact Chip Scale Package (0.65mm pitch) for-
mat saves board space and eases layout in space
critical applications compared to discrete solutions
and traditional wire bonded packages
• Lead-free versions available
Applications
• ESD protection for sensitive electronic equipment
• I/O port, keypad and button circuitry protection for
portable devices
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Cameras and Camcorders
• Notebooks
• Desktop PCs
Product Description
The CM1205 family of transient voltage suppressor
arrays provides a very high level of protection for sensi-
tive electronic components that may be subjected to
ESD.
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard (Level 4, +8kV contact dis-
charge). All I/Os are rated at +25kV using the IEC
61000-4-2 contact discharge method. Using the MIL-
STD-883D (Method 3015) specification for Human
Body Model (HBM) ESD, all pins are protected for con-
tact discharges to greater than +30kV.
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards with-
out the use of underfill.
The CM1205 features OptiGuardTM coating for
improved reliability at assembly and is available with
optional lead-free finishing.
Electrical Schematic
B1 B2 B3
B1 B2 B3 B4 B5
D1 D2 D3 D4 D5
A1 A2 A3
CM1205-04CS/CP
A1 A2 A3 A4 A5
CM1205-08CS/CP
C1 C2 C3 C4 C5
B1 B2 B3 B4 B5
A1 A2 A3 A4 A5
CM1205-16CS/CP
© 2003 California Micro Devices Corp. All rights reserved.
11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
1




California Micro Devices

CM1205 Datasheet Preview

CM1205 Datasheet

ESD Protection Arrays Chip

No Preview Available !

www.DataShCeeMt41U.2co0m5
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
A
B
123
L05
Orientation
Marking
(see note 2)
A
B
TOP VIEW
(Bumps Down View)
12345
120508
Orientation
Marking
(see note 2)
A
TOP VIEW
(Bumps Down View)
12345
CM1405-04
CSP Package
CM1405-08
CSP Package
BOTTOM VIEW
(Bumps Up View)
B1 B2 B3
A1 A2 A3
BOTTOM VIEW
(Bumps Up View)
B1 B2 B3 B4 B5
A1 A2 A3 A4 A5
BOTTOM VIEW
(Bumps Up View)
D1 D2 D3 D4 D5
B
120516
C
C1 C2 C3 C4 C5
B1 B2 B3 B4 B5
D A1 A2 A3
CM1405-16
Notes:
CSP Package
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
A4
A5
Ordering Information
PART NUMBERING INFORMATION
Bumps
6
10
20
Package
CSP
CSP
CSP
Standard Finish
Ordering Part
Number1
Part Marking
CM1205-04CS
L05
CM1205-08CS
120508
CM1205-16CS
120516
Lead-free Finish2
Ordering Part
Number1
Part Marking
CM1205-04CP
L05
CM1205-08CP
120508
CM1205-16CP
120516
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2003 California Micro Devices Corp. All rights reserved.
2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
11/17/03


Part Number CM1205
Description ESD Protection Arrays Chip
Maker California Micro Devices
PDF Download

CM1205 Datasheet PDF





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