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Cypress Semiconductor Electronic Components Datasheet

CYIWOSC3000AA Datasheet

3.1 Megapixel CMOS Sensor

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Features
• HiSENS™ High Sensitivity in low-light conditions
• 1/2.8” optical format image sensor
• Fast frame readout at full resolution
• Progressive scan
• I2C serial control interface
• Selectable 8 and 12 bit parallel data port
• Low-power 30 frames/s preview mode
• Programmable controls: frame size, frame rate, gain
exposure, blanking, flip and mirroring, windowing, auto
black level offset correction and panning
• Horizontal and vertical binning for increased sensitivity
• Available in 48-pin PLCC package
Applications
• Cellular phone camera modules
• Pocket PCs
• PDAs
• Toys
• Battery operated devices
CYIWOSC3000AA
3.1 Megapixel CMOS Sensor
Table 0-1. Key Performance Parameters
Parameter
Optical Format
Active Imager Size
Active Pixels
Pixel Size
Color Filter Array
Shutter Type
Maximum Data Rate/
Master Clock
Frame Rate
ADC Resolution
Dynamic Range
Responsivity
SNRMAX in dB
Supply Voltage @ 25°C
Analog and Digital Power
Consumption
Operating Temperature
Packaging
Typical Value
1/2.8-inch
5.2 mm x 3.9 mm
2048H x 1536V
2.54 μm x 2.54 μm
RGB Bayer Pattern
Electronic Rolling Shutter
48 MPS/48 MHz
14 fps (2048 x 1536)
80 fps (640 x 480)
12-bit (72 dB), on-chip
55 dB
>1.0V/lux-sec (550 nm)
QXGA: 35
VGA: 40
Analog: 2.5V–3.1V
Digital: 1.65V–2.0V
I/O: 1.8V–2.8V
60 mW @ 30 fps (640 x 480)
215 mW @ 15 fps (2048 x 1536)
–30°C to +70°C
48-pin PLCC
www.DataSheet4U.com
Cypress Semiconductor Corporation
Document #: 38-19009 Rev. *E
• 198 Champion Court
• San Jose, CA 95134-1709 • 408-943-2600
Revised April 03, 2006


Cypress Semiconductor Electronic Components Datasheet

CYIWOSC3000AA Datasheet

3.1 Megapixel CMOS Sensor

No Preview Available !

CYIWOSC3000AA
TABLE OF CONTENTS
FEATURES ............................................................................................................................................................. 1
APPLICATIONS ..................................................................................................................................................... 1
1.0 GENERAL DESCRIPTION ............................................................................................................................... 4
2.0 PIN DESCRIPTION .......................................................................................................................................... 5
3.0 FUNCTIONAL OVERVIEW .............................................................................................................................. 6
4.0 SIGNAL DESCRIPTION ................................................................................................................................... 7
5.0 PIXEL ARRAY STRUCTURE ........................................................................................................................... 8
6.0 DATA FORMATS ............................................................................................................................................. 9
6.1 Frame Timing ................................................................................................................................................................ 9
6.2 Frames per Second and Integration Time Calculation ................................................................................................ 10
6.3 Output Data Timing ..................................................................................................................................................... 10
7.0 SERIAL BUS DESCRIPTION ......................................................................................................................... 11
7.1 Serial Bus Protocol ...................................................................................................................................................... 11
7.2 Detailed Timing ............................................................................................................................................................ 11
7.3 Single Random WRITE ................................................................................................................................................ 12
7.4 Multiple WRITE ............................................................................................................................................................ 12
7.5 Single Random READ ................................................................................................................................................. 12
7.6 Multiple Sequential READ ........................................................................................................................................... 12
8.0 REGISTERS ................................................................................................................................................... 13
8.1 Register Map ............................................................................................................................................................... 13
8.2 Control Registers ......................................................................................................................................................... 15
8.3 Status Registers .......................................................................................................................................................... 30
9.0 FEATURE DESCRIPTIONS ........................................................................................................................... 32
9.1 HiSENS™ .................................................................................................................................................................... 32
9.2 Power Saver Settings .................................................................................................................................................. 32
9.3 Selectable Frame Rate ................................................................................................................................................ 32
9.4 FPN Reduction ............................................................................................................................................................ 33
9.5 Black Level Setting and Averaging .............................................................................................................................. 33
9.6 Digital Gain per Color .................................................................................................................................................. 33
www.DataSh99e..87et4REUxe.pscooomsluutrioenCCoonntrtorol l................................................................................................................................................................................................................................................................................................................
33
33
9.9 Sub-window Control .................................................................................................................................................... 33
9.10 Analog On-chip Binning ............................................................................................................................................. 33
9.11 Digital On-chip Binning .............................................................................................................................................. 33
9.12 50-/60-Hz Flicker Reduction ...................................................................................................................................... 33
9.13 Blanking Time, PCLK and Sync Polarity .................................................................................................................... 33
9.14 Power-on Reset ......................................................................................................................................................... 34
9.15 On-chip Test Pattern Generation ............................................................................................................................... 34
9.16 Exposure Control Region of Interest (ROI) ................................................................................................................ 34
9.17 Register Setting Sync Control .................................................................................................................................... 34
9.18 Preview and Video Mode ........................................................................................................................................... 34
9.19 Parallel Digital Interface ............................................................................................................................................. 34
10.0 ELECTRICAL SPECIFICATIONS ................................................................................................................ 35
10.1 Absolute Maximum Ratings ....................................................................................................................................... 35
10.2 Operating Conditions ................................................................................................................................................. 35
11.0 ELECTRICAL CHARACTERISTICS ............................................................................................................ 35
12.0 48-PIN PLCC PACKAGE DIAGRAM ........................................................................................................... 36
12.1 Ordering Information .................................................................................................................................................. 36
Document #: 38-19009 Rev. *E
Page 2 of 37


Part Number CYIWOSC3000AA
Description 3.1 Megapixel CMOS Sensor
Maker Cypress Semiconductor
Total Page 30 Pages
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