ZXMC3AMC mosfet equivalent, 30v complementary pair enhancement mode mosfet.
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* Low profile package, for thin applications Low RθJA, thermally efficient package 2 6mm footprint, 50% smaller than TSOP6 a.
Low RθJA, thermally efficient package 2 6mm footprint, 50% smaller than TSOP6 and SOT23-6 Low on-resistance Fast switchi.
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