* MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE d H b F8G CED 687 9¡@ SYM A B B1 B2 B3 C C1 C2 D D1 D2 D3 D4 M
DT8C04
Diotec Semiconductor
347.43 KB
(dt8c00 - dt8c10) 8 amp silicon bridge rectifiers.
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