MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-I.

(DT8C00 - DT8C10) 8 AMP SILICON BRIDGE RECTIFIERS

DT8C00

DT8C01

DT8C02

DT8C04

DT8C08

DT8C10

DT8211

DT830

DT890B

DT890C

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