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DIM800ECM33-F000 - IGBT Chopper Module

Key Features

  • Soft Punch Through Silicon Isolated AlSiC Base with AlN Substrates High Thermal Cycling Capability 10µs Short Circuit Withstand Lead Free construction KEY.

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Datasheet Details

Part number DIM800ECM33-F000
Manufacturer Dynex Semiconductor
File Size 884.92 KB
Description IGBT Chopper Module
Datasheet download datasheet DIM800ECM33-F000 Datasheet

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www.DataSheet4U.com DIM800ECM33-F000 IGBT Chopper Module DS5815-1.2 January 2009(LN26568) FEATURES Soft Punch Through Silicon Isolated AlSiC Base with AlN Substrates High Thermal Cycling Capability 10µs Short Circuit Withstand Lead Free construction KEY PARAMETERS V CES V CE(sat) * (typ) IC (max) I C(PK) (max) *(measured at the auxiliary terminals) 3300V 2.8V 800A 1600A APPLICATIONS Choppers Motor Controllers Power Supplies The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 1200V to 6500V and currents up to 3600A. The DIM800ECM33-F000 is a 3300V, soft punch through n-channel enhancement mode, insulated gate bipolar transistor (IGBT) chopper module.