EDB8164B3PF - 8G bits DDR2 Mobile RAM

Features

JEDEC LPDDR2-S4B compliance.
DLL is not implemented.
Low power consumption.
Mobile RAM functions.
Partial Array Self-Refresh (PASR).
Auto Temperature Compensated Self-Refresh (ATCSR) by built-in temperature sensor.
Deep power-down mode.
Per Bank Refresh.
This FBGA is suitable for Package on Package (PoP) Block Diagram VDD1 VDD2 VDDQ VREFCA_a, VREFCA_b VREFDQ_a, VREFDQ_b VSS CK_a, /CK_a CA0_a to.

ELPIDA

Datasheet Details

Part number	EDB8164B3PF
Manufacturer	ELPIDA
File Size	183.99 KB
Description	8G bits DDR2 Mobile RAM
Datasheet	EDB8164B3PF Datasheet
Additional preview pages of the EDB8164B3PF datasheet.

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EDB4064B3PB - 4G bits DDR2 Mobile RAM

Full PDF Text Transcription

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DATA SHEET 8G bits DDR2 Mobile RAM™ PoP (12mm × 12mm, 216-ball FBGA) EDB8164B3PF Specifications • Density: 8G bits • Organization — 2 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Data rate: 1066Mbps (max.) • Package: 216-ball FBGA — Package size: 12.0mm × 12.0mm — Ball pitch: 0.4mm — Lead-free (RoHS compliant) and Halogen-free • Power supply — VDD1 = 1.70V to 1.95V — VDD2, VDDQ = 1.14V to 1.

Published: Dec 3, 2017 |