• Part: RMPA2266
  • Description: WCDMA Band I Power Amplifier Module
  • Manufacturer: Fairchild Semiconductor
  • Size: 222.07 KB
Download RMPA2266 Datasheet PDF
RMPA2266 page 2
Page 2
RMPA2266 page 3
Page 3

Datasheet Summary

PRELIMINARY RMPA2266 i-Lo™ WCDMA Band I Power Amplifier Module April 2007 RMPA2266 i-Lo™ WCDMA Band I Power Amplifier Module Features - 40% WCDMA efficiency at +28dBm Pout - 20% WCDMA efficiency (58mA total current) at - - - - tm General Description - - - The RMPA2266 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA +16dBm Pout applications. Answering the call for ultra-low DC power Low quiescent current (Iccq): 25mA in low-power consumption and extended battery life in portable mode electronics, the RMPA2266 uses novel proprietary Meets UMTS/WCDMA performance requirements circuitry to dramatically reduce...