LPA6836V vias equivalent, medium power phemt with source vias.
* 25 dBm Output Power at 1-dB Compression at 18 GHz
* 9.5 dB Power Gain at 18 GHz
* 55% Power-Added Efficiency
* Source Vias to Backside Metallization
DRA.
DIE SIZE: 15.4X14.2 mils (390x360 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 3.0X3.0 mils (75x75 µm)
The FPA68.
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