* Section 3, “Maximum Tolerated Ratings” Section 4, “Thermal Characteristics” Section 5, “Power Dissipation” Section 6, “DC Characteristics” Section 7, “Thermal Calculation and Measurement” Section 8, “Power Supply and Power Sequencing” Section 9, “Layout Practices” Section 10, “Bus Signal Timing” Se
MPC859
Freescale Semiconductor
1.24 MB
Hardware specifications.
Freescale Semiconductor, Inc. Advance Information MPC866EC/D Rev. 1.4, 8/2003 MPC866/859 Hardware Specifications Freescale Semiconductor, Inc This d.
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