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FPT-208P-M06 - LOW PROFILE QUAD FLAT PACKAGE 208 PIN PLASTIC

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www.DataSheet4U.com FUJITSU SEMICONDUCTOR DATA SHEET LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M06 208-pin plastic LQFP Lead pitch Package width × package length Lead shape Sealing method 0.50 mm 28 × 28 mm Gullwing Plastic mold (FPT-208P-M06) 208-pin plastic LQFP (FPT-208P-M06) 30.00±0.20(1.181±.008)SQ 28.00±0.10(1.102±.004)SQ 156 105 1.70(.067)MAX. (Mounting height) "A" 104 157 0.08(.003) Details of "A" part 0.25(.010) 1.70(.067)MAX. (Mounting height) INDEX 208 53 0~8° 0.45/0.75 (.018/.030) 0.10±0.05 (.004±.002) (Stand off) LEAD No. 1 52 0.50(.0197) TYP 0.22 –0.04 .009 –.002 +0.05 +.002 0.08(.003) M 0.145 –0.03 .006 –.001 +0.05 +.
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