Datasheet Summary
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FUJITSU SEMICONDUCTOR DATA SHEET
LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE
208 PIN PLASTIC
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208-pin plastic LQFP Lead pitch Package width × package length Lead shape Sealing method 0.50 mm 28 × 28 mm Gullwing Plastic mold
(FPT-208P-M06)
208-pin plastic LQFP (FPT-208P-M06)
30.00±0.20(1.181±.008)SQ 28.00±0.10(1.102±.004)SQ
156 105
1.70(.067)MAX. (Mounting height) "A"
0.08(.003)
Details of "A" part 0.25(.010) 1.70(.067)MAX. (Mounting height)
INDEX
0~8° 0.45/0.75 (.018/.030) 0.10±0.05 (.004±.002) (Stand off)
LEAD No.
0.50(.0197) TYP
- 0.04 .009
- .002
+0.05 +.002
0.08(.003)...