Datasheet Summary
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FUJITSU SEMICONDUCTOR DATA SHEET
THIN SHRINK SMALL OUTLINE PACKAGE
20 PIN PLASTIC
20-pin plastic TSSOP Lead pitch Package width × package length Lead shape Sealing method Mounting height Weight 0.65 mm 4.40 × 6.50 mm Gullwing Plastic mold 1.20 mmMAX 0.08g P-TSSOP20-4.4×6.5-0.65
(FPT-20P-M04)
Code (Reference)
20-pin plastic TSSOP (FPT-20P-M04)
Note 1)
- 1 : Resin protrusion. (Each side : +0.15 (.006) Max). Note 2)
- 2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder.
0.17±0.03 (.007±.001)
- 1 6.50±0.10(.256±.004)
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