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FPT-20P-M04 - THIN SHRINK SMALL OUTLINE PACKAGE

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www.DataSheet4U.com FUJITSU SEMICONDUCTOR DATA SHEET THIN SHRINK SMALL OUTLINE PACKAGE 20 PIN PLASTIC FPT-20P-M04 20-pin plastic TSSOP Lead pitch Package width × package length Lead shape Sealing method Mounting height Weight 0.65 mm 4.40 × 6.50 mm Gullwing Plastic mold 1.20 mmMAX 0.08g P-TSSOP20-4.4×6.5-0.65 (FPT-20P-M04) Code (Reference) 20-pin plastic TSSOP (FPT-20P-M04) Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max). Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. 0.17±0.03 (.007±.001) 11 *1 6.50±0.10(.256±.004) 20 *24.40±0.10 INDEX 6.40±0.20 (.173±.004) (.252±.008) Details of "A" part 1.10±0.10 (Mounting height) (.043±.
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