Datasheet Summary
GS8321V18/32/36E-250/225/200/166/150/133
165-Bump FP-BGA mercial Temp Industrial Temp
2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs
250 MHz- 133 MHz 1.8 V VDD 1.8 V I/O
Features
- IEEE 1149.1 JTAG-patible Boundary Scan
- 1.8 V +10%/- 10% core power supply
- 1.8 V I/O supply
- LBO pin for Linear or Interleaved Burst mode
- Internal input resistors on mode pins allow floating mode pins
- Byte Write (BW) and/or Global Write (GW) operation
- Internal self-timed write cycle
- Automatic power-down for portable applications
- JEDEC-standard 165-bump FP-BGA package
- Pb-Free 165-bump BGA package available
Functional Description
Applications The GS8321V18/32/36E is a 37,748,736-bit high...