FESB16FT Datasheet | General Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - Glass passivated chip junction - Low power loss - Low forward voltage, high current capability - High surge current capability - Superfast recovery time, for high efficiency - High temperature soldering in accordance with CECC 802 / Reflow guaranteed 0.320 (8.13) 0.360 (9.14) 1 K 2 0.575 (14.60) 0.625 (15.88) SEATING PLATE -T- 0.090 (2.29) 0.110 (2.79) 0.018 (0.46) 0.025 (0.64) 0.027 (0.686) 0.037 (0.940) 0.080 (2.03) 0.110 (2.79) 0.095 (2.41) 0.100 (2.54) MECHANICAL DATA Case: JEDEC TO-263AB molded plastic body over passivated chips Terminals: Plated lead solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Weight: 0.08 ounce, 2.24 grams PIN 1 K - HEATSINK PIN 2 Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. FESB SYMBOLS 16AT FESB 16BT FESB 16CT FESB 16DT FESB 16FT FESB FESB 16GT 16HT FESB 16JT UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TC=100°C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) at TC=100°C Maximum instantaneous forward voltage at 16A Maximum DC reverse current at rated DC blocking voltage Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating and storage temperature range TC=25°C TC=100°C VRRM VRMS VDC I(AV) 50 35 50 100 70 100 150 105 150 200 140 200 300 210 300 400 280 400 500 350 500 600 Volts 420 Volts 600 Volts Amps IFSM VF IR trr CJ RΘJC TJ, TSTG 35.0 0.975 250.0 1.3 10.0 500.0 50.0 175.0 1.2 -65 to +150 145.0...