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HSMG-H690 Datasheet Surface Mount Flip Chip Leds

Manufacturer: HP

Overview: H Surface Mount Flip Chip LEDs Technical Data HSMX-H670 Series HSMX-H690.

This datasheet includes multiple variants, all published together in a single manufacturer document.

General Description

The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs.

The internal flip chip construction eliminates the wire bond between the chip and printed circuit board.

Consequently as a result of the robust construction, product reliability is greatly improved.

Key Features

  • Improved Reliability Through Elimination of Internal Wire Bond.
  • -40 to 85°C Operating Temperature Range.
  • Small Size.
  • Industry Standard Footprint.
  • Diffused Optics.
  • Compatible with IR Solder Process.
  • Four Colors Available.
  • Available in 8 mm Tape on 7" (178 mm) Diameter Reels.

More Datasheets from HP

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HSMG-H690 Distributor