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HB56D136BW Datasheet High Density Dynamic RAM Module

Manufacturer: Hitachi Semiconductor (now Renesas)

Download the HB56D136BW datasheet PDF. This datasheet also includes the HB56D136 variant, as both parts are published together in a single manufacturer document.

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Note: The manufacturer provides a single datasheet file (HB56D136-HitachiSemiconductor.pdf) that lists specifications for multiple related part numbers.

General Description

The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in SOJ package.

An outline of the HB56D136 is 72-pin single in-line package.

Therefore, the HB56D136 makes high density mounting possible without surface mount technology.

Overview

HB56D136 Series 1,048,576-word × 36-bit High Density Dynamic RAM Module ADE-203-209A (Z) Rev 1.0 Sept.

Key Features

  • 72-pin.
  • Lead pitch: 1.27 mm.
  • Single 5 V (±5%) supply.
  • High speed.
  • Access time: 60 ns/70 ns/80 ns (max).
  • Low power dissipation.
  • Active mode: 5.46 W/4.94 W/4.41 W (max).
  • Standby mode: 105 mW (max) 5.25 mW (max) (L-version).
  • Fast page mode capability.
  • 1,024 refresh cycle: 16 ms 128 ms (L-version).
  • 3 variations of refresh.
  • RAS only refresh.
  • CAS-before-RAS refresh.
  • Hidden ref.

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