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HB56D473EJ-7 - High Density Dynamic RAM Module

Download the HB56D473EJ-7 datasheet PDF. This datasheet also covers the HB56D473EJ variant, as both devices belong to the same high density dynamic ram module family and are provided as variant models within a single manufacturer datasheet.

General Description

The HB56D473EJ belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications.

Key Features

  • 168-pin socket type package (Dual lead out)  Outline: 133.35 mm (Length) × 25.40 mm (Height) × 9.00 mm (Thickness)  Lead pitch: 1.27 mm.
  • Single 5 V (±5%) supply.
  • High speed  Access time: tRAC = 60/70 ns (max) tCAC = 20/25 ns (max).
  • Low power dissipation  Active mode: 12.5/11.3 W (max)  Standby mode (TTL): 588 mW (max) (CMOS): 462 mW (max).
  • Buffered input except RAS and DQ.
  • 4 byte interleave enabled, dual address input (A0/B0).

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HB56D473EJ-HitachiSemiconductor.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by Hitachi Semiconductor (now Renesas)

Part Number Description
HB56D473EJ-6 High Density Dynamic RAM Module
HB56D436BR High Density Dynamic RAM Module
HB56D436SBR High Density Dynamic RAM Module
HB56D136 High Density Dynamic RAM Module
HB56D136BW High Density Dynamic RAM Module

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
HB56D473EJ Series 4,194,304-word × 72-bit High Density Dynamic RAM Module ADE-203-725A (Z) Rev. 1.0 Feb. 27, 1997 Description The HB56D473EJ belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. The HB56D473EJ is a 4M × 72 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM (HM5117400) sealed in SOJ package and 8 pieces of 4-Mbit DRAM (HM514100) sealed in SOJ package, 1 pieces of 16bit BiCMOS line driver (74ABT16244) sealed in TSSOP package and 1 pieces of 20-bit BiCMOS line driver (74ABT16827) sealed in TSSOP package. An outline of the HB56D473EJ is 168-pin socket type package (dual lead out).