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H9CKNNN8GTMPLR Datasheet 8Gb LPDDR3

Manufacturer: SK Hynix

Overview: 168ball FBGA Specification 8Gb LPDDR3 (x32) This document is a general.

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General Description

and is subject to change without notice.

SK hynix does not assume any responsibility for use of circuits described.

No patent licenses are implied.

Key Features

  • [ FBGA ].
  • Operation Temperature - (-30)oC ~ 105oC.
  • Package - 168-ball FBGA - 12.0x12.0mm2, 0.70t, 0.50mm pitch - Lead & Halogen Free [ LPDDR3 ].
  • VDD1 = 1.8V (1.7V to 1.95V).
  • VDD2, VDDCA and VDDQ = 1.2V (1.14V to 1.30).
  • HSUL_12 interface (High Speed Unterminated Logic 1.2V).
  • Double data rate architecture for command, address and data Bus; - all control and address except CS_n, CKE latched at both rising and falling edge of the clock - CS_n, CKE latched at rising edg.

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