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H9CKNNN8GTMPLR-NUH Datasheet 8Gb LPDDR3

Manufacturer: SK Hynix

Download the H9CKNNN8GTMPLR-NUH datasheet PDF. This datasheet also includes the H9CKNNN8GTMPLR variant, as both parts are published together in a single manufacturer document.

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Note: The manufacturer provides a single datasheet file (H9CKNNN8GTMPLR-Hynix.pdf) that lists specifications for multiple related part numbers.

General Description

and is subject to change without notice.

SK hynix does not assume any responsibility for use of circuits described.

No patent licenses are implied.

Overview

168ball FBGA Specification 8Gb LPDDR3 (x32) This document is a general.

Key Features

  • [ FBGA ].
  • Operation Temperature - (-30)oC ~ 105oC.
  • Package - 168-ball FBGA - 12.0x12.0mm2, 0.70t, 0.50mm pitch - Lead & Halogen Free [ LPDDR3 ].
  • VDD1 = 1.8V (1.7V to 1.95V).
  • VDD2, VDDCA and VDDQ = 1.2V (1.14V to 1.30).
  • HSUL_12 interface (High Speed Unterminated Logic 1.2V).
  • Double data rate architecture for command, address and data Bus; - all control and address except CS_n, CKE latched at both rising and falling edge of the clock - CS_n, CKE latched at rising edg.

More Datasheets from SK Hynix

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