H9CKNNN8GTMPLR Overview
Key Features
- Operation Temperature
- (-30)oC ~ 105oC
- 168-ball FBGA
- 12.0x12.0mm2, 0.70t, 0.50mm pitch
- Lead & Halogen Free [ LPDDR3 ]
- VDD2, VDDCA and VDDQ = 1.2V (1.14V to 1.30)
- HSUL_12 interface (High Speed Unterminated Logic 1.2V)
- Double data rate architecture for command, address and data Bus
- all control and address except CS_n, CKE latched at both rising and falling edge of the clock
- CS_n, CKE latched at rising edge of the clock
