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H9DP32A4JJBCGR-KEM - 4GB eNAND Flash(x8) + 4Gb Mobile DDR

Download the H9DP32A4JJBCGR-KEM datasheet PDF. This datasheet also covers the H9DP32A4JJBCGR variant, as both devices belong to the same 4gb enand flash(x8) + 4gb mobile ddr family and are provided as variant models within a single manufacturer datasheet.

General Description

and is subject to change without notice.

for use of circuits described.

No patent licenses are implied.

Key Features

  • [ CI-MCP ].
  • Operation Temperature - (-25)oC ~ 85oC.
  • Package - 153-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ DDR SDRAM ].
  • Packaged NAND flash memory with MultiMediaCard interface.
  • e-NAND system specification, compliant with V4.41.
  • Full backward compatibility with previous eNAND system specification.
  • Bus mode - High-speed eMMC protocol. - Three different data bus widths: 1 bit, 4 bits,8 bits. - Data transfer rate: up to 104Mbyt.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (H9DP32A4JJBCGR-Hynix.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer

Other Datasheets by SK Hynix

Part Number Description
H9DP32A4JJBCGR 4GB eNAND Flash(x8) + 4Gb Mobile DDR
H9DA4GH4JJAMCR NAND 4Gb(x16) / mobile DDR 4Gb(x32 2CS)

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
CI-MCP Specification 4GB eNAND Flash(x8) + 4Gb Mobile DDR (x32) This document is a general product description and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 0.1 / Nov. 2012 1 Preliminary H9DP32A4JJBCGR eNAND 4GB(x8) / Mobile DDR 4Gb(x32, 2CS) Document Title CI-MCP 4GB(x8) eNAND Flash / 4Gb (x32) Mobile DDR Revision History Revision No. History 0.1 - Initial Draft 0.2 - Updated DC and AC CHARACTERISTICS Draft Date Nov. 2012 Nov. 2012 Remark Preliminary Preliminary Rev 0.1 / Nov. 2012 2 Preliminary H9DP32A4JJBCGR eNAND 4GB(x8) / Mobile DDR 4Gb(x32, 2CS) FEATURES [ CI-MCP ] ● Operation Temperature - (-25)oC ~ 85oC ● Package - 153-ball FBGA - 11.5x13.0mm2, 1.0t, 0.