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Integrated Silicon Solution Electronic Components Datasheet

IS42S16100H Datasheet

16Mb SYNCHRONOUS DYNAMIC RAM

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IS42S16100H
IS45S16100H
512K Words x 16 Bits x 2 Banks
16Mb SYNCHRONOUS DYNAMIC RAM
OCTOBER 2016
FEATURES
• Clock frequency: 200, 166, 143 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Two banks can be operated simultaneously and
independently
• Dual internal bank controlled by A11 (bank select)
• Single 3.3V power supply
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• 2048 refresh cycles every 32ms (Com, Ind, A1
grade) or 16ms (A2 grade)
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and
precharge command
• Byte controlled by LDQM and UDQM
• Packages: 400-mil 50-pin TSOP-II and 60-ball
TF-BGA
• Temperature Grades:
Commercial (0oC to +70oC)
Industrial (-40oC to +85oC)
Automotive A1 (-40oC to +85oC)
Automotive A2 (-40oC to +105oC)
DESCRIPTION
ISSI’s 16Mb Synchronous DRAM IS42/4516100H
is organized as a 524,288-word x 16-bit x 2-bank for
improved performance. The synchronous DRAMs
achieve high-speed data transfer using pipeline
architecture. All inputs and outputs signals refer to the
rising edge of the clock input.
Copyright © 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the
latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can rea-
sonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applica-
tions unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com 1
Rev. A1
10/11/2016


Integrated Silicon Solution Electronic Components Datasheet

IS42S16100H Datasheet

16Mb SYNCHRONOUS DYNAMIC RAM

No Preview Available !

IS42S16100H, IS45S16100H
PIN CONFIGURATIONS
50-Pin TSOP (Type II)
VDD
DQ0
DQ1
GNDQ
DQ2
DQ3
VDDQ
DQ4
DQ5
GNDQ
DQ6
DQ7
VDDQ
LDQM
WE
CAS
RAS
CS
A11
A10
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
PIN DESCRIPTIONS
A0-A10
Row Address Input
A11
Bank Select Address
A0-A7
Column Address Input
DQ0 to DQ15 Data DQ
CLK
System Clock Input
CKE
Clock Enable
CS
Chip Select
RAS
Row Address Strobe Command
50 GND
49 DQ15
48 DQ14
47 GNDQ
46 DQ13
45 DQ12
44 VDDQ
43 DQ11
42 DQ10
41 GNDQ
40 DQ9
39 DQ8
38 VDDQ
37 NC
36 UDQM
35 CLK
34 CKE
33 NC
32 A9
31 A8
30 A7
29 A6
28 A5
27 A4
26 GND
CAS Column Address Strobe Command
WE Write Enable
LDQM Lower Bye, Input/Output Mask
UDQM Upper Bye, Input/Output Mask
VDD Power
GND Ground
VDDQ Power Supply for DQ Pin
GNDQ Ground for DQ Pin
NC No Connection
2 Integrated Silicon Solution, Inc. — www.issi.com
Rev. A1
10/11/2016


Part Number IS42S16100H
Description 16Mb SYNCHRONOUS DYNAMIC RAM
Maker ISSI
Total Page 30 Pages
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