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IXGA7N60B - HiPerFAST IGBT

Features

  • G = Gate, E = Emitter, E C (TAB) C = Collector, TAB = Collector Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Md Weight Mounting torque, (TO-220) TO-220 TO-263.
  • International standard packages JEDEC TO-263 surface mountable and JEDEC TO-220 AB.
  • Medium frequency IGBT.
  • High current handling capability.
  • HiPerFASTTM.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com HiPerFASTTM IGBT IXGA 7N60B IXGP 7N60B VCES IC25 VCE(sat) tfi = 600 V = 14 A = 2 V = 150 ns Symbol VCES VCGR VGES VGEM IC25 IC90 ICM SSOA (RBSOA) PC TJ TJM Tstg Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MΩ Continuous Transient TC = 25°C TC = 90°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 22 Ω Clamped inductive load, L = 300 µH TC = 25°C Maximum Ratings 600 600 ±20 ±30 14 7 30 ICM = 14 @ 0.8 VCES 54 -55 ... +150 150 -55 ... +150 300 Μ3 Μ3.5 0.45/4 0.55/5 4 2 V V V V A A A TO-220AB (IXGP) G CE TO-263 AA (IXGA) G A W °C °C °C °C Nm/lb.in. g g Features G = Gate, E = Emitter, E C (TAB) C = Collector, TAB = Collector Maximum lead temperature for soldering 1.6 mm (0.062 in.
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