Description
Preliminary data HiP erF ASTTM IGBT HiPerF erFAST IXGH22N50B IXGH22N50BS VCES IC(25) VCE(sat)typ tfi(typ) TO-247 SMD * = 500 V = 44 A = 2.1 V =.
Features
* International standard packages
JEDEC TO-247 SMD surface mountable and JEDEC TO-247 AD
Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Md Weight Mounting torque (M3)
* High frequency IGBT
* High current handling capability
* HiPerFAST
Applications
* Uninterruptible power supplies (UPS)
* Switched-mode and resonant-mode
Symbol Test Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. 500 2.5 TJ = 25°C TJ = 125°C ±100 2.1 2.5 V V µA mA nA V power supplies
BVCES VGE(th) ICES IGES VCE(sat)
IC