* z Maximum Lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Maximum Tab temperature for soldering SMD devices for 10 s Md Weight Mounting torque (M3) 1.13/10Nm/lb.in. TO-247 AD TO-268 6 4 g g z z International standard packages JEDEC TO-268 and JEDEC TO-247 AD High current hand
IXGH32N170 Datasheet (610.43 KB)
IXGH32N170
IXYS Corporation
610.43 KB
High voltage igbt.
High Voltage IGBT Preliminary Data Sheet IXGH 32N170 VCES IXGT 32N170 IC25 VCE(sat) tfi(typ) = 1700 V = 75 A = 3.3 V = 250 ns www.DataSheet4U.com .
📁 Related Datasheet
IXGH32N170A High Voltage IGBT (IXYS)
IXGH32N120A3 Ultra-Low Vsat PT IGBT (IXYS)
IXGH32N50B HiPerFAST IGBT (IXYS Corporation)
IXGH32N50BS HiPerFAST IGBT (IXYS Corporation)
IXGH32N50BU1 HiPerFAST IGBT (IXYS Corporation)
IXGH32N50BU1S HiPerFAST IGBT (IXYS Corporation)
IXGH32N60A HiPerFAST IGBT (IXYS Corporation)
IXGH32N60AS HiPerFAST IGBT (IXYS Corporation)
IXGH32N60AU1 HiPerFAST IGBT (IXYS Corporation)
IXGH32N60AU1S HiPerFAST IGBT (IXYS Corporation)
