Download the IXGT24N60C datasheet PDF.
This datasheet also covers the IXGH24N60C variant, as both devices belong to the same hiperfast igbt family and are provided as variant models within a single manufacturer datasheet.
Key Features
G = Gate, E = Emitter,
Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Md Weight Mounting torque (M3) TO-247 TO-268
1.13/10 Nm/lb. in. 6 4 g g.
International standard packages JEDEC TO-247 and surface mountable TO-268.
Full PDF Text Transcription for IXGT24N60C (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
IXGT24N60C. For precise diagrams, and layout, please refer to the original PDF.
HiPerFASTTM IGBT LightspeedTM Series IXGH 24N60C IXGT 24N60C VCES IC25 VCE(sat)typ tfi typ = 600 V = 48 A = 2.1 V = 60 ns Preliminary data www.DataSheet4U.com Symbol VCES...
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48 A = 2.1 V = 60 ns Preliminary data www.DataSheet4U.com Symbol VCES VCGR VGES VGEM IC25 IC110 ICM SSOA (RBSOA) PC TJ TJM Tstg Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MW Continuous Transient TC = 25°C TC = 110°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 22 W Clamped inductive load, L = 100 mH TC = 25°C Maximum Ratings 600 600 ±20 ±30 48 24 96 ICM = 48 @ 0.8 VCES 150 -55 ... +150 150 -55 ... +150 300 V V V V A A A A TO-268 (IXGT) G E C (TAB) TO-247 AD (IXGH) C (TAB) G C E C = Collector, TAB = Collector W °C °C °C °C Features G = Gate, E = Emitter, Maximum lead temperature for soldering 1.6 mm (0
IXGT24N60C Datasheet
