Maximum lead temperature for soldering Ÿ International standard packages Ÿ Low RDS (on) HDMOSTM process Ÿ Rugged polysilicon gate cell structure Ÿ Low package inductanc.

VDSS VGS(th) IGSS IDSS RDS(on) VGS = 0 V, ID = 250 µA VDS = VGS, ID = 250 µA VGS = ±20 VDC, VDS = 0 VDS = VDSS VGS = 0.

IXTP2N80P

IXTP2N100

IXTP2N100P

IXTP2N60P

IXTP2N65X2

IXTP200N055T2

IXTP200N075T

IXTP200N085T

IXTP20N65X

IXTP20N65XM

IXTP220N04T2

IXTP220N055T

IXTP220N075T