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BGF104C Key Features

  • ESD protection and filter for High Speed Multi Media Card interface
  • ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs
  • 16 pin green wafer level package with SnAgCu solder balls
  • RoHS and WEEE pliant package
  • 500 µm solder ball pitch
  • 300 µm solder ball diameter

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BGF104C Description

BGF104C is an ESD protection and filter circuit for a high speed multi media card interface. External pins are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green leadfree package with a size of only 1.92 mm x 1.92.