Infineon Technologies BGF106
The BGF106 is an ESD protection circuit and filtering interface for SIM cards. The external pins are protected against ESD up to 15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green leadfree package with a size of only 1.2 mm x 1.2 mm and a total height of 0.6 mm C2 A3 B3 C3 R1, 100 Ω R2, 47 Ω R3, 100 Ω Ext.| Part No. | BGF106 |
|---|---|
| Datasheet | BGF106 Download |
| Manufacturer |  Infineon Technologies |
| Description | SIM Card Interface Filter and ESD Protection |
| Buy | Stock & Price |
FEATURES
● ESD protection circuit and interface filter for SIM cards● Integrated ESD protection of external pins up to 15 kV contact discharge according to IEC61000-4-2
● Wafer level package with SnAgCu solder balls
● 400 µm solder ball pitch
● RoHS and WEEE compliant package WLP-8-8-N-3D
DESCRIPTION
IOs A2 B1 C1 GND, B2 BGF106 _schematic.vsd Figure 1 Type BGF106 Table 1 Parameter Schematic Package WLP-8-8MAXIMUM RATINGS
Symbol Min. Values Typ. – – – – – – Max. 5 +85 +150 60 2 15 V °C °C mW kV kV 0 -40 -65 – -2 -15 Unit Note / Test Condition – – – Marking GF106 Chip N0727 Voltage at all pins to GND Operating temperature range Storage temperature range Summed up into power for all pins Contact discharge at internal pins A3, B3, C3 VP TOP TSTG Pin TS < 70 °C – – Electrostatic Discharge According to IEC61000-4-2 VESD Contact discharge at external pins A2, B1, C1, VESD C2 Data Sheet 4 V2.2, 2008-02-19 Datasheet pdf - BGF106 SIM Card Interface Filter and ESD Protection BGF106 Table 2 Parameter Electrical Characteristics1) Symbol Min.
