Infineon Technologies BGF104C
BGF104C is an ESD protection and filter circuit for a high speed multi media card interface. The wafer level package is a green leadfree package with a size of only 1.92 mm x 1.92 mm and a total height of 0.65 mm.| Part No. | BGF104C |
|---|---|
| Datasheet | BGF104C Download |
| Manufacturer |  Infineon Technologies |
| Description | HSMMC Interface Filter and ESD Protection |
| Buy | Stock & Price |
FEATURES
● ESD protection and filter for High Speed Multi Media Card interface● ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs
● 16 pin green wafer level package with SnAgCu solder balls
● RoHS and WEEE compliant package
● 500 µm solder ball pitch
● 300 µm solder ball diameter WLP-16-3-N
DESCRIPTION
External pins are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. R10, 75kΩ R11, 75kΩ R12, 75kΩ R13, 75kΩ Int. IOs V MMC R14, 7kΩ Ext. IOs V dd R2, 50 Ω R3, 50 Ω R4, 50 Ω R5, 50 Ω R6, 50 Ω R7, 50 Ω clk cmd dat 0 dat 1 dat 2 dat 3 A3 A2 A1 B2 B1 C1 D1 A4 B4 C4 C3 D4 D3 MMCclk MMCcmd MMCdat0 MMCdat1 MMCdat2 MMCdat3 B3, C2, D2 GND BGF104_ schematic.vsd Figure 1 Type BGF104C Schematic Package WLP-16-3 Marking 4C Chip N0708 Data Sheet 4 V2.0, 2009-11-12 Datasheet pdf - BGF104C HSMMC Interface Filter and ESD Protection BGF104C Table 1 ParameterMAXIMUM RATINGS
Symbol Min. Values Typ. – – – – – Max. 14 +85 +150 15 2 V °C °...
