BGF104C Description
BGF104C is an ESD protection and filter circuit for a high speed multi media card interface. External pins are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green leadfree package with a size of only 1.92 mm x 1.92.
BGF104C Key Features
- ESD protection and filter for High Speed Multi Media Card interface
- ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs
- 16 pin green wafer level package with SnAgCu solder balls
- RoHS and WEEE pliant package
- 500 µm solder ball pitch
- 300 µm solder ball diameter