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BGF112 Key Features

  • ESD protection circuit and filter for AV I/F interface
  • Integrated ESD protection at external pins of 15 kV contact discharge according to IEC61000-4-2
  • Wafer level package with SnAgCu solder balls
  • RoHS and WEEE pliant package
  • 400 µm solder ball pitch

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BGF112 Description

BGF112 is an ESD protection circuit and EMI filtering device for an AV I/F interface for mobile applications. The external pins are protected against ESD pulses of 15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green leadfree package with a size of only 0.76 mm x 1.16 mm and a total height of 0.6 mm Int.